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Thin Film Techniques - NEVF103

Title:	Technika tenkých vrstev
Guaranteed by:	Department of Surface and Plasma Science (32-KFPP)
Faculty:	Faculty of Mathematics and Physics
Actual:	from 2020
Semester:	summer
E-Credits:	5
Hours per week, examination:	summer s.:2/1, C+Ex [HT]
Capacity:	unlimited
Min. number of students:	unlimited
4EU+:	no
Virtual mobility / capacity:	no
State of the course:	taught
Language:	Czech, English
Teaching methods:	full-time
Teaching methods:	full-time
Additional information:	https://physics.mff.cuni.cz/kfpp/rozvrh.html

Guarantor:	doc. RNDr. Pavel Sobotík, CSc. prof. RNDr. Ivan Ošťádal, CSc. doc. RNDr. Pavel Kocán, Ph.D.

Opinion survey results Examination dates SS schedule Noticeboard

Annotation -

Last update: T_KEVF (19.03.2003)

Basic concepts of termodynamic and vacuum physics. Growth types and phases of thin film growth. Overwiev of thin film deposition methods - CVD, vacuum evaporation, sputtering methods, laser ablation, electron beam ablation, principles, examples a comparison. Methods of thickness and deposition rate measurement. Methods for determination of morphology and composition of thin films. Adhesion and hardness of thin films. Preparation and cleaning of substrates for thin film technologies. Preparation of defined thin film structures - masking and litography.

Course completion requirements - Czech

Last update: doc. RNDr. Jiří Pavlů, Ph.D. (03.06.2020)

Získání zápočtu je podmínkou pro konání zkoušky.

Udělení zápočtu je podmíněno absolvováním dvou praktických úloh a vypracováním protokolu k nim.

Povaha kontroly studia předmětu vylučuje opakování této kontroly, zápočet se tedy opakovat nedá.

Literature - Czech

Last update: T_KEVF (07.05.2005)

Krishna Seshan-editor.: Handbook of Thin-Film Deposition Processes and Techniques, Noyes Publications- William Andrew Publishing , Norwitch, New York 2002

Eckertová L.: Physics of Thin Films, Plenum Press, NY 1986

Requirements to the exam - Czech

Last update: doc. RNDr. Pavel Sobotík, CSc. (05.03.2018)

Zkouška probíhá ústní formou.

Požadavky odpovídají sylabu předmětu v rozsahu, který byl prezentován na přednášce.

Syllabus -

Last update: T_KEVF (07.05.2005)

1. Thin film deposition techniques -physical methods
Vacuum evaporation (equilibrium vapor pressure, evaporation rate, angular dependence of the evaporation flux, construction of evaporators , evaporation of alloys and compounds, electron beam evaporation, MBE). Sputtering (basic ideas, sputtering systems, magnetron, comparison of sputtering and evaporation). Laser ablation. Electron beam ablation. Ionised cluster beam deposition.

2. Thin film deposition techniques -chemical methods
CVD (decomposition, disproporciation, transport reactions,VLPCVD, PECVD, MOCVD). Anodic oxidation, LB films.

3. Methods of deposition rate measurement and thickness measurement
Measurement in a flux of vapors. Quartz oscilator technique. Optical methods (Tolansky method, FECO, spectral reflectivity measurements).

4. Techniques of measurement of thin film and surface morphology
TEM, SEM, STM, AFM, LEEM, FIM, FEM.

5. Techniques for determination of thin film structure and composition
Difrakční metody. Spektroskopie. Interakce s ionty (RBS, SIMS).

6. Substrate treatment
Chemical treatment. Etching. Annealing.

7. Litography, masking and nanopatterning
Ion etching. Selective etching. Using of photoresists.

8. Thin film properties
Hardness , adhesion and conductivity measurements.