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Course, academic year 2016/2017
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Low Temperature Plasma and Its Applications - NEVF501
Title: Nízkoteplotní plazma a jeho aplikace
Guaranteed by: Department of Surface and Plasma Science (32-KFPP)
Faculty: Faculty of Mathematics and Physics
Actual: from 2008 to 2018
Semester: winter
E-Credits: 3
Hours per week, examination: winter s.:2/0, Ex [HT]
Capacity: unlimited
Min. number of students: unlimited
4EU+: no
Virtual mobility / capacity: no
State of the course: taught
Language: Czech
Teaching methods: full-time
Teaching methods: full-time
Guarantor: doc. RNDr. Věra Hrachová, CSc.
RNDr. Karel Rohlena, CSc.
Class: DS, fyzika plazmatu a ionizovaných prostředí
Classification: Physics > Surface Physics and P. of Ion.M.
Comes under: Pro rok 2019/2020 + 2021/2022...
Annotation -
Last update: T_KEVF (18.05.2005)
Kinetic desctription of plasma. Influence of the various types of interactions on the electron energy distribution function. Low-temperature plasma in the discharges. Influnce of the various processes and composition. Plasma treatment of surfaces, thin films deposition. This lecture is determined for the doctoral study, in the odd years only.
Literature - Czech
Last update: T_KEVF (18.05.2005)

Kracík J., Tobiáš J.: Fyzika plazmatu, Academia Praha 1966.

Raizer J. P.: Gas Discharge Physics, Springer Verlag, Berlin, Heidelberg, 1991.

Ricard A.: Reactive plasmas, Paris 1996.

Syllabus -
Last update: T_KEVF (18.05.2005)
1. Kinetic description of low-temperature plasma
Solution of the kinetic equation, Focker-Planck collision term. Influence of the elastic and non-elastic collisions on the electron energy distribution function. Influence of the elektron-electron collision. Maxwellian and non-Maxwellian distributions of electrons. Magnetic field influence. Collision frequency.

2. Low-temperature discharge plasma and its application in the technologies
Plasma in dc and ac discharges. Influence of the diffusion, recombination, beta and gamma processes on these discharge behaviour. Processes near the electrodes. Influence of chemically active milieu on the plasma processes (e.g., electronegative gases, cataphoresis, tec.). Ions and neutral particle interactions with surfaces. Plasma surface treatment (cathode sputtering, etching, sterilisation, tec.). Thin film deposition, various influence on the film properties. Computational modelling in the plasma chemistry.

 
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